Description
- LGA 1700 socket for 12/13/14th Gen. Intel® ADL & RPL Processor (65W/35W TDP)
- Intel® R680E Chipset
- NVIDIA RTX A2000 12GB Graphics based on NVIDIA Ampere Architecture-Based CUDA Cores
- 2x DDR5 4800/5600MHz SODIMM
. Max. up to 64GB - 7 Display interface supported by 1x DVI-I, 2x DisplayPort, 4x Mini DisplayPort
- 2x Intel® 2.5 GbE supporting Wake-on-LAN and PXE
- 1x Full-size Mini PCIe for communication or expansion modules, 2x SIM socket
- 2x 15mm Hot-swappable NVMe SSD, Support RAID 0, 1
- 1x 9mm 2.5″ SATA SSD (Internal), 1x 7mm 2.5″ SATA SSD (Hot-swap)
- 1x M.2 (E Key, PCIe x1, USB 2.0, 2230)
- 1x M.2 (B Key, 2242/3042/3052, PCIe x2, Support AI Module/NVMe Storage, PCIe x1 & USB 3.2 Gen1, Support 4G/5G)
- 6x RS-232/422/485 (4x internal), 8x USB 3.2 Gen 2, 1x USB 3.2 Gen 1 (internal)
- 9 to 48VDC Wide Range Power Input Supporting AT/ATX Mode
- Wide Operating Temperature -25°C to 45°C (35W/65W CPU)
- TPM 2.0 Supported
. Max. up to 64GBLe RCO-6000-RPL-2NA2000 est une intégration de fonctionnalités extrêmes, de performances système exceptionnelles, de connexions d’E/S polyvalentes. C’est un système embarqué sans ventilateur d’une fiabilité à toute épreuve. Il offre des performances CPU et graphiques considérablement améliorées, une grande évolutivité en termes de puissance et de fonctionnalités, des fonctionnalités avancées, des E/S d’extension modulaires, des interfaces de connectivité riches, une large gamme (9~48V) d’entrée d’alimentation CC et une grande fiabilité.
Grâce à sa conception sans câble, haute fonctionnalité, son boîtier monobloc et au système anti-vibration, ce produit est un système robuste qui peut évoluer dans des environnements difficiles, il est facile à installer et à entretenir. Il possède une protection contre les surtensions (OVP), une protection contre les surintensités (OCP), une protection contre les inversions de polarité et une large plage d’alimentation en courant continu ce qui fait de ce système une solution de sécurité pour toutes les applications industrielles.
Voir la famille de PC RCO-6000-RPL sur le site fabricant.
ProcessorSupport 12/13th/14th(Non-vPRO) Gen Intel® ADL & RPL Processor (LGA 1700, 65W/35W TDP)
•Intel® Core™ i9-14900/i9-13900E/i9-12900E, up to 24 Cores, 36MB Cache, up to 5.8 GHz, 65W
•Intel® Core™ i9-14900T/i9-13900TE/i9-12900TE, up to 24 Cores, 36MB Cache, up to 5.5 GHz, 35W
•Intel® Core™ i7-14700, up to 20 Cores, 33MB Cache, up to 5.4 GHz, 65W
•Intel® Core™ i7-14700T, up to 20 Cores, 33MB Cache, up to 5.2 GHz, 35W
•Intel® Core™ i7-13700E/i7-12700E, up to 16 Core, 30MB Cache, up to 5.1 GHz, 65W
•Intel® Core™ i7-13700TE/i7-12700TE, up to 16 Cores, 30MB cache, up to 4.8 GHz, 35W
•Intel® Core™ i5-14500/i5-13500E/i5-12500E, up to 14 Cores, 24MB Cache, up to 5.0 GHz, 65 W
•Intel® Core™ i5-14500T/i5-13500TE/i5-12500TE, up to 14 Core, 24MB Cache, up to 4.8 GHz, 35W
•Intel® Core™ i3-13100E/i3-12100E, up to 8 Cores, 12MB cache, up to 4.4 GHz, 60W
•Intel® Core™ i3-14100T/i3-13100TE/i3-12100TE, up to 4 Cores, 12MB Cache, up to 4.4 GHz, 35W
•Intel® Core™ 300T, up to 2 Cores, 6MB Cache, up to 3.4 GHz, 35W
•Intel® Pentium® G7400E,2 Cores, 6MB Cache, 3.6 GHz, 46W
•Intel® Pentium® G7400TE, 2 Cores, 6MB Cache, 3.0 GHz, 35W
•Intel® Celeron® G6900E, 2 Cores, 4MB Cache, 3.0 GHz, 46W
•Intel® Celeron® G6900TE, 2 Cores, 4MB Cache, 2.4 GHz, 35W
| System | |
|---|---|
| System Chipset | Intel® R680E Chipset |
| LAN Chipset | 2.5 GbE1: Intel I226, 2.5 GbE2: Intel I226 Support Wake-on-LAN and PXE, Support TSN |
| Audio Codec | Realtek ALC888S |
| System Memory | 2x 262-Pin DDR5 4800 /5600MHz SODIMM. Max. up to 64GB (ECC and Non-ECC) |
| Graphics | Intel® UHD Graphics 770/710 or NVIDIA RTX A2000 12GB integrated |
| BIOS | AMI 256Mbit SPI BIOS |
| Watchdog | Software Programmable Supports 1~255 sec. System Reset |
| TPM | TPM 2.0 |
| Display | |
|---|---|
| Display Port | 2x DisplayPort, Support resolution 5120 x 3200, Up to 7680 x 4320 |
| DVI | 1x DVI-I, support resolution 1920 x 1200 |
| Multiple Display | 7 Display interfaces |
| Mini Displayport | 4x Mini DisplayPort, Support resolution 5120 x 2880, Up to 7680 x 4320 |
| Storage | |
|---|---|
| M.2 | 1x M.2 B Key, 2242/3042/3052 (PCIe x2, Support AI Module/NVMe Storage) (PCIe x1 & USB 3.2 Gen1, Support 4G/5G) |
| SIM Socket | 2x External SIM socket (Mini PCIE/M.2 B Key attached) |
| mSATA | 1x mSATA (Shared by 1x Mini PCI Express) |
| SSD/HDD | 1x 9mm 2.5″ SATA HDD Bay (Internal) 1x 7mm 2.5″ SATA HDD Bay (Hot-swappable) Support RAID 0, 1 |
| Expansion | |
|---|---|
| Mini PCIe | 2x Full-size Mini PCIe |
| Expansion Modules 2x EDGEBoost I/O Brackets: • 4-port GbE module with Intel® I350 Chipset, RJ-45/M12 connector (PoE optional) • 2-Port RJ45 10GbE with Intel X710 Chipset • 4-Port USB 3.0 (share PCIe Gen2 x1 bandwidth) • 1x M.2 B-Key, 2242 for AI/NVMe, 1x M.2 B-Key, 3042/3052 for 5G/AI/NVMe • 1x M.2 M-Key, PCIe x4 Lane, 2242/2260 for AI Module/NVMe • 1x M.2 for 5G (B Key, PCIe x1, USB 3.0, 3042/3052), 2x SIM socket, 1x SIM switch | |
| Operating System | |
|---|---|
| Windows | Windows 10/11 |
| Linux | Linux kernel |
| I/O | |
|---|---|
| Audio | 1x Mic-in, 1x Line-out |
| CAN | 2x CAN 2.0 A/B 2-pin Internal header |
| COM | 2x RS-232/422/485 ; 6x RS-232/422/485 (internal) |
| DIO | 8 in / 8 out (Isolated) |
| LAN | 2x RJ45 |
| Universal I/O Bracket | 2x EDGEBoost I/O Bracket (By mini PCIe interface) |
| USB | 8x USB 3.2 Gen 2 (10 Gbps) 1x USB 3.2 Gen 1 (5 Gbps, 1x Internal) 2x USB 2.0 header (internal) |
| Others | 5x WiFi Antenna Holes 1x Power Switch, 1x AT/ATX Switch 1x Remote Power On/Off 1x PC/Car Mode Switch, 1x Delay Time Switch 1x Removable CMOS Battery |
| Power | |
|---|---|
| Power Adapter | Optional AC/DC 24V/9.2A, 220W Optional AC/DC 24V/11.67A, 280W 3Optional AC/DC 24V/15A, 360W (i7/i9 CPU/GPU/Card Expansion) |
| Power Mode | AT, ATX |
| Power Ignition Sensing | Power Ignition Management |
| Power Supply Voltage | 9~48VDC |
| Power Connector | 5-pin Terminal Block |
| Power Protection | OVP (Over Voltage Protection); OCP (Over Current Protection) Reserve Protection |
| Environment | |
|---|---|
| Operating Temperature | -25°C to 45°C (35W/65W CPU) (Optional External Fan Kit: Recommended for i9 CPU/65W) |
| Storage Temperature | -30°C to 85°C |
| Relative Humidity | 10% to 95% (non-condensing) |
| Certification | CE, FCC Class A |
| Vibration | IEC60068-2-64:2008 With HDD: 1 Grms (5 – 500 Hz, 0.5 hr/axis) With SSD: 5 Grms (5 – 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810G Method 514.7 Procedure I |
| Shock | IEC60068-2-27:2008 With SSD: 20G half-sin 11ms Designed to comply with MIL-STD-810G Method 516.7 Procedure I |
| Physical | |
|---|---|
| Construction | 240 (W) x 261 (D) x 166.9 (H) mm |
| Weights | 11~12kg |
| Construction | Extruded Aluminum with Heavy Duty Metal |
| Mounting Options | Wall Mounting |
- – For 12/13/14th CPUs configured to run at 65W, operating temperatures will be limited to 45°C.
- – 65W CPUS may experience thermal throttling depending on extreme application workloads; this is also due to an increase in the physical CPU cores from the Intel silicon (up to 24 cores). Please note, this does not indicate system malfunction or problems in the fanless design. Please consult our embedded engineers for the best configuration to match your application requirements.
- – All product specifications and information are subject without notice.
